{"id":1761,"date":"2022-11-09T10:10:42","date_gmt":"2022-11-09T09:10:42","guid":{"rendered":"https:\/\/www.university-press.fau.de\/produkt\/a-digital-power-amplifier-in-28-nm-cmos-for-lte-applications\/"},"modified":"2023-11-20T15:11:19","modified_gmt":"2023-11-20T14:11:19","slug":"978-3-944057-94-1","status":"publish","type":"product","link":"https:\/\/www.university-press.fau.de\/en\/product\/978-3-944057-94-1\/","title":{"rendered":"A Digital Power Amplifier in 28 nm CMOS for LTE Applications"},"content":{"rendered":"<p>This book shows the development of a power amplifier for LTE at the edge of planar CMOS technology. It includes theoretical design concepts, simulations and measurements for a power amplifier based on uplink specifications for mobile communication defined by 3GPP. It proofs the basic capability of CMOS technology for a full integration on a SoC.<\/p>\n<p>Different power amplifier classes and linearization concepts are summarized and compared. A special focus is given on a selection of published watt-level power amplifiers as well as implemented DPAs. These basic considerations were the foundation for the later implemented designs.<\/p>\n<p>A stand-alone linear power amplifier was developed and characterized as a bare bumped die on a PCB. The DPA was integrated into an LTE transceiver what gave the possibility of on-chip verification of the entire system.<\/p>\n<p>Die pictures of the linear PA and the DPA show their architectures, which are implemented on-chip in 28nm CMOS technology, from the top metal layer perspective.<\/p>","protected":false},"excerpt":{"rendered":"<p>Dieses Buch zeigt die Entwicklung eines Leistungsverst\u00e4rkers f\u00fcr LTE an der Grenze der ebenen CMOS-Technologie. Es beinhaltet theoretische Design-Konzepte, Simulationen und Messungen f\u00fcr einen Leistungsverst\u00e4rker basierend auf den Hochlad-\u00dcbertragungs-Spezifikationen f\u00fcr die Mobilfunkkommunikation, definiert von 3GPP. Es zeigt die grundlegende F\u00e4higkeit der CMOS-Technologie f\u00fcr eine volle Integration auf einem kompletten System auf einem einzelnen Chip. Unterschiedliche [&hellip;]<\/p>\n","protected":false},"featured_media":2397,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[53],"product_tag":[],"class_list":{"0":"post-1761","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-fau-studien-aus-der-elektrotechnik","7":"has-post-title","8":"has-post-date","9":"has-post-category","10":"has-post-tag","11":"has-post-comment","12":"has-post-author","13":"","15":"first","16":"instock","17":"taxable","18":"shipping-taxable","19":"purchasable","20":"product-type-simple"},"acf":{"autor":"J\u00f6rg Fuhrmann","orcid":"","ror":"","herausgeber":"","orcid_hrsg":"","rorhrsg":"","bearbeiter":"","sonstige_beteiligte_personen":"","untertitel":"","zusatz":"","jahr":"2016","zeitschrift":"","serie":"","serie_name":"","serie_band":"","serie_jahr":"","serie_titel_band":"","vortrage":"","issn":"","isbn":"","isbn13":"978-3-944057-94-1","seiten":"xix, 159","sonstiges":"","band":6,"auflage":"","opus":7951,"dspace":"7951","e-isbn_pdf":"978-3-944057-95-8","doi":"","epub":"","e-isbn_epub":"","doi_epub":"","html":"","e-isbn_html":"","doi_html":"","e-isbn_reader":"","doi_reader":"","digibib":"","urn":"urn:nbn:de:bvb:29-opus4-79512","supplementary_material":"","sprache":["Englisch"],"ausgabe":"Softcover","suche":" 9783944057941 9783944057958  ","lizenz":"BY-NC-ND-3","bemerkung":""},"builder_content":"","_links":{"self":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product\/1761","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/comments?post=1761"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media\/2397"}],"wp:attachment":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media?parent=1761"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_brand?post=1761"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_cat?post=1761"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_tag?post=1761"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}