{"id":3106,"date":"2023-04-04T13:30:45","date_gmt":"2023-04-04T11:30:45","guid":{"rendered":"https:\/\/www.university-press.fau.de\/?post_type=product&#038;p=3106"},"modified":"2023-11-20T16:22:17","modified_gmt":"2023-11-20T15:22:17","slug":"978-3-96147-619-0","status":"publish","type":"product","link":"https:\/\/www.university-press.fau.de\/en\/product\/978-3-96147-619-0\/","title":{"rendered":"Korrelation von Materialqualit\u00e4t und Ausfallmechanismen leistungselektronischer SiC-Bauelemente"},"content":{"rendered":"<p>The purpose of this work was to establish a correlation between the material defects in Silicon Carbide (SiC) and failure modes of high-voltage and high-power 4H-SiC semiconductor trench-MOSFET devices. N-type SiC homoepitaxial layers were grown to be able to investigate epilayers in addition to the substrates. These layers were analysed for their surface and crystallographic defects. The method of characterisation was utilizing confocal as well as differential interference contrast (DIC) optics for surface inspection and ultra-violet photoluminescence (UV-PL) imaging. The defect-characterized epitaxial wafers were then used to manufacture trench-MOSFET devices. All finished devices were electrically tested. The electrical yield received through this method was then overlayed with the defect data previously measured during processing. Finally, those extensively investigated devices were used for reliability tests.<\/p>","protected":false},"excerpt":{"rendered":"<p>Ziel dieser Arbeit war es, eine Korrelation der Siliciumcarbid (SiC) Materialqualit\u00e4t mit Ausfallmechanismen leistungselektronischer 4H-SiC Trench-MOSFET Bauelemente herzustellen. Daf\u00fcr wurden homo-epitaktische, n-leitende SiC-Schichten abgeschieden. Diese Schichten wurden anschlie\u00dfend mit konfokaler DIC-Mikroskopie und UV-PL Methoden hinsichtlich ihrer Defekte charakterisiert. Die so charakterisierten Epitaxie-Wafer wurden zur Herstellung von leistungselektronischen Trench-MOSFET Bauelementen verwendet. Nach der Prozessierung wurden die [&hellip;]<\/p>\n","protected":false},"featured_media":3107,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[53],"product_tag":[],"class_list":{"0":"post-3106","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-fau-studien-aus-der-elektrotechnik","7":"has-post-title","8":"has-post-date","9":"has-post-category","10":"has-post-tag","11":"has-post-comment","12":"has-post-author","13":"","15":"first","16":"instock","17":"taxable","18":"shipping-taxable","19":"purchasable","20":"product-type-simple"},"acf":{"autor":"Baierhofer, Daniel","orcid":"0000-0002-7498-0529","ror":"","herausgeber":"","orcid_hrsg":"","rorhrsg":"","bearbeiter":"","sonstige_beteiligte_personen":"","untertitel":"","zusatz":"","jahr":"2023","zeitschrift":"","serie":"","serie_name":false,"serie_band":"","serie_jahr":"","serie_titel_band":"","vortrage":"","issn":"","isbn":"","isbn13":"978-3-96147-619-0","seiten":"xviii, 243","sonstiges":"","band":18,"auflage":"","opus":21495,"dspace":"21495","e-isbn_pdf":"978-3-96147-620-6","doi":"https:\/\/doi.org\/10.25593\/978-3-96147-620-6","epub":"","e-isbn_epub":"","doi_epub":"","html":"","e-isbn_html":"","doi_html":"","e-isbn_reader":"","doi_reader":"","digibib":"","urn":"urn:nbn:de:bvb:29-opus4-214951","supplementary_material":"","sprache":["Deutsch"],"ausgabe":"Softcover","suche":" 9783961476190 9783961476206  ","lizenz":"BY-4","bemerkung":""},"builder_content":"","_links":{"self":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product\/3106","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/comments?post=3106"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media\/3107"}],"wp:attachment":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media?parent=3106"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_brand?post=3106"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_cat?post=3106"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_tag?post=3106"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}