Through hole mounted components are important electronic devices to enable global technological trends especially in automation, e-mobility and digitalization. As the mixed SMT- and THT-component placement accounts for the major portion of power electronic modules, selective wave soldering of the THT-components is industry standard procedure. The process quality is measured by means of solder hole fill which is primarily affected by the solder joint design. The soldering process incorporates complex physical interrelations involving thermal and material flow with multivariant impact parameters between design and hole fill. Therefore, neither a design dependent hole fill prediction is available nor do the state-of-the-art design rules reliably guarantee manufacturability. Hence, to en-sure manufacturability a process model is required that accounts for all relevant process impact factors and can predict the selective wave soldering process result in terms of hole fill.
\nThe objective of this work is to predict and optimize the hole fill as the criterion of manufacturability based on a data driven modeling approach. Therefore, the impact factors are investigated by means of design of experiments, multi-physics simulation and analytical calculation procedures. A machine learning model is used to model the soldering process by means of historical experimental data. To optimize all aspects of the soldering process and recommend suitable process parameters, the fluxing and soldering process is optimized using a grid search, heuristical traveling salesman algorithms and a Monte Carlo simulation.<\/p>","protected":false},"excerpt":{"rendered":"
THT-Bauteile sind entscheidende Komponenten zur Realisierung globaler technologischer Trends speziell im Bereich Automatisierung, E-Mobilit\u00e4t und Digitalisierung. Ein Gro\u00dfteil der leistungselektronischen Flachbaugruppen wird dabei mit SMT- und THT-Bauteilen best\u00fcckt. Der industrielle Standard zur L\u00f6tung der THT-Bauteile ist der Selektivwellenl\u00f6tprozess. Der Lotdurchstieg als Ma\u00df f\u00fcr die Prozessqualit\u00e4t wird dabei besonders durch das Design der THT-L\u00f6tstelle beeinflusst. Auf […]<\/p>\n","protected":false},"featured_media":3998,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[34],"product_tag":[],"class_list":{"0":"post-3997","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-fau-studien-aus-dem-maschinenbau","7":"has-post-title","8":"has-post-date","9":"has-post-category","10":"has-post-tag","11":"has-post-comment","12":"has-post-author","13":"","15":"first","16":"instock","17":"taxable","18":"shipping-taxable","19":"purchasable","20":"product-type-simple"},"acf":{"autor":"Seidel, Reinhardt","orcid":"0000-0003-3370-5456","ror":"","herausgeber":"","orcid_hrsg":"","rorhrsg":"","bearbeiter":"","sonstige_beteiligte_personen":"","untertitel":"","zusatz":"","jahr":"2023","zeitschrift":"","serie":"","serie_name":false,"serie_band":"","serie_jahr":"","serie_titel_band":"","vortrage":"","issn":"","isbn":"","isbn13":"978-3-96147-651-0","seiten":"xxii, 167","sonstiges":"","band":425,"auflage":"","opus":"","dspace":"30198","e-isbn_pdf":"978-3-96147-652-7","doi":"https:\/\/doi.org\/10.25593\/978-3-96147-652-7","epub":"","e-isbn_epub":"","doi_epub":"","html":"","e-isbn_html":"","doi_html":"","e-isbn_reader":"","doi_reader":"","digibib":"","urn":"urn:nbn:de:101:1-2023122904023701069521","supplementary_material":"","sprache":["Deutsch"],"ausgabe":"Softcover","suche":" 9783961476510 9783961476527 ","lizenz":"BY-NC-4","bemerkung":""},"builder_content":"","_links":{"self":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product\/3997","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/comments?post=3997"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media\/3998"}],"wp:attachment":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media?parent=3997"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_brand?post=3997"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_cat?post=3997"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_tag?post=3997"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}