{"id":6427,"date":"2026-03-17T11:34:25","date_gmt":"2026-03-17T10:34:25","guid":{"rendered":"https:\/\/www.university-press.fau.de\/?post_type=product&#038;p=6427"},"modified":"2026-03-17T11:34:26","modified_gmt":"2026-03-17T10:34:26","slug":"978-3-96147-868-2","status":"publish","type":"product","link":"https:\/\/www.university-press.fau.de\/en\/product\/978-3-96147-868-2\/","title":{"rendered":"Plasmabasierte Kupfermetallisierung von leistungselektronischen Bauelementen"},"content":{"rendered":"<p>The use of wide-band-gap semiconductors (WBG) enables the construction of highly efficient and perfomant power electronic modules both in drives of modern electric vehicles and generative concepts for the generation of renewable energies, thus making an important contribution to the energy and mobility transition. The use of thermal plasma-based coating processes enables an extension of conventional processes of packaging and interconnection technology in power electronics by a highly flexible and efficient process to reliably contact WBG components and to utilize their potential in terms of current density, switching frequency and operating temperature. This dissertation deals with the qualification of a thermal plasma-based coating process for the construction of copper-based functional surfaces on substrate materials in power electronics and their suitability for subsequent processes. The main focus here is on the use as a functional surface for the top-side interconnection of power semiconductors using thick-copperwire bonds.<\/p>","protected":false},"excerpt":{"rendered":"<p>Der Einsatz von Wide-Band-Gap Halbleitern (WBG) erm\u00f6glicht den Aufbau hoch effizienter und perfomanter leistungselektronischer Module sowohl in Antrieben moderner Elektrofahrzeuge als auch generativer Konzepte f\u00fcr die Gewinnung erneuerbarer Energien und leistet so einen wichtigen Beitrag f\u00fcr die Energie- und Mobilit\u00e4tswende. Der Einsatz thermischer plasmabasierter Beschichtungsprozesse erm\u00f6glicht eine Erweiterung konventioneller Prozesse der Aufbau- und Verbindungstechnik in [&hellip;]<\/p>\n","protected":false},"featured_media":6428,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[34],"product_tag":[],"class_list":{"0":"post-6427","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-fau-studien-aus-dem-maschinenbau","7":"has-post-title","8":"has-post-date","9":"has-post-category","10":"has-post-tag","11":"has-post-comment","12":"has-post-author","13":"","15":"first","16":"instock","17":"taxable","18":"shipping-taxable","19":"purchasable","20":"product-type-simple"},"acf":{"autor":"Hensel, Alexander","orcid":"0009-0002-8201-7895","ror":"00f7hpc57","herausgeber":"","orcid_hrsg":"","rorhrsg":"","bearbeiter":"","sonstige_beteiligte_personen":"","untertitel":"","zusatz":"","jahr":"2025","zeitschrift":"","serie":"","serie_name":false,"serie_band":"","serie_jahr":"","serie_titel_band":"","vortrage":"","issn":"","isbn":"","isbn13":"978-3-96147-868-2","seiten":"xxii, 153","sonstiges":"","band":471,"auflage":"","opus":"","dspace":"39116","e-isbn_pdf":"978-3-96147-869-9","doi":"https:\/\/doi.org\/10.25593\/978-3-96147-869-9","epub":"","e-isbn_epub":"","doi_epub":"","html":"","e-isbn_html":"","doi_html":"","e-isbn_reader":"","doi_reader":"","digibib":"","urn":"","supplementary_material":"","sprache":["Deutsch"],"ausgabe":"Softcover","suche":" 9783961478682 9783961478699  ","lizenz":"BY-NC-4","bemerkung":"1\tFAU Press\r\n1\tHB\r\n4\tBSB \/ DNB\r\n1\tTNZB\r\n1\tTIB"},"builder_content":"","_links":{"self":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product\/6427","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/comments?post=6427"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media\/6428"}],"wp:attachment":[{"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/media?parent=6427"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_brand?post=6427"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_cat?post=6427"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.university-press.fau.de\/en\/wp-json\/wp\/v2\/product_tag?post=6427"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}