Description
Our everyday life in the modern digital communication society is increasingly based on data from the environment that is recorded and processed with sensors in mechatronic systems. In the future, applications are going to use this information obtained to independently derive more and more actions and generate added value for people.
Due to the constant increase in the density of functional integration within everyday applications while at the same time reducing the installation space, the demands on the reliability of all assembled components are increasing. This research work is based on the miniaturization of electrical conductor track geometries on three-dimensional mechatronic-integrated components (3D-MID). Experience shows an early failure in connection with small conductor track cross-sections, caused by thermomechanical stresses between the polymer substrate materials and the metallized electrical conductor tracks.
For this purpose, the use of alternative epoxy resin-based duromers that can be processed in the transfer molding and injection molding process is investigated. Compared to the thermoplastic materials typically used up today, such as polycarbonates, polyamides and liquid-crystalline polyamides, they offer a significantly lower coefficient of thermal expansion (CTE).
The research focus is on the development of a chemically based activation process for laser-based, selective-additive metallization of a fine-pitch conductor track layout on non-conductive substrates. Thanks to the ideal adaptation of the materials within the multi-material composite, the possible uses of 3D-MID applications in the area of package assemblies can be expanded and the degree of miniaturization increased.
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