Plasmabasierte Kupfermetallisierung von leistungselektronischen Bauelementen

Description

The use of wide-band-gap semiconductors (WBG) enables the construction of highly efficient and perfomant power electronic modules both in drives of modern electric vehicles and generative concepts for the generation of renewable energies, thus making an important contribution to the energy and mobility transition. The use of thermal plasma-based coating processes enables an extension of conventional processes of packaging and interconnection technology in power electronics by a highly flexible and efficient process to reliably contact WBG components and to utilize their potential in terms of current density, switching frequency and operating temperature. This dissertation deals with the qualification of a thermal plasma-based coating process for the construction of copper-based functional surfaces on substrate materials in power electronics and their suitability for subsequent processes. The main focus here is on the use as a functional surface for the top-side interconnection of power semiconductors using thick-copperwire bonds.