Qualifizierung der Kupfer-Drahtbondtechnologie für integrierte Leistungsmodule in harschen Umgebungsbedingungen

Description

From the generation of electrical energy through distribution and storage to the use in mechatronic applications, power electronic switches are the backbone of global megatrends. As a bottleneck in today's power electronics, the current assembly and interconnection technology cannot keep up with the increased technological and economic requirements. This holds especially true for the established aluminum wire bonding contacts.

A material-sided adaptation of the established aluminum wire bonding process to copper offers the opportunity to significantly expanding the range of applications of wire bonding technology. Increased current flows can be handled even at elevated ambient temperatures. An adjusted material matrix reduces thermo-mechanical stress and thus increases reliability of the electromechanical system. Statistical methods and models allow deduction of process windows, the assessment of the process partners’ influence and an adapted process and product design.

At the same time, copper wire bonding allows for customized layout designs. Not only being cost-efficient and robust, but also being a flexible interconnection pro-cess, copper wire bonding bears the chance to be a valuable partner for additive manufacturing technologies in creating advanced layouts and packages. As a bridge between signal and power electronics, wire bonding can ensure the neces-sary flexibility of future manufacturing concepts. A rigid, purely two-dimensional de-sign and manufacturing philosophy is thus replaced by integrated power electronics in flexible and individual installation spaces and modules. Being a bridge between the signal and power electronics, wire bonding can ensure the necessary flexibility for prospective manufacturing concepts.

This work qualifies the copper wire bonding process for integrated power modules in harsh environmental conditions. The focus is on a material-sided adaptation of the bonding process as well as the integration of the copper bonding process in a varia-ble and robust manufacturing environment.